Equipment dimensions (L X W X H) 1000 x 1050 x 2200 mm

Weight 1450 kg

Power demand 230 V ± 10% AC, 50/60 Hz,

Single phase power supply, neutral and grounding conductor

Fuse protection 16 A

Maximum power consumption 2.5 kVA

Maximum radiation leakage rate *<1 μ Sv/h

*Data measured 100 MM from the surface of lead room

Test components

Maximum sample size 440 x 550 mm (17 "x 21")

Maximum scanning area 310 x 310 mm (12 "x 12")

Maximum sample bearing (standard) 5 kg

Maximum rotatable sample weight 2 kg

General product parameters

Time of first picture (typical)~10 s

System reset time (typical)<60 s

μ CT scanning time (fast scanning)

2000 projections~3.15 minutes

μ CT reconstruction time (fast scanning)

2000 projections~1.55 minutes

Micro3D scanning time (micro 3DSlice

Semiconductor) 120 projections~1.45 minutes

Micro3D reconstruction time (micro 3DSlice

Semiconductor) 120 pieces of projection~0.30 minutes

Sample loading Sample loading door manual

Lead room window 380 x 200 mm

Display 27 "inch wide angle sharp display

Zoom Configuration

Stage

The console is controlled by mouse or rocker

Stage control axis X, Y, Z (D)*

Detector tilt angle/- 70 ° (140 °)

*Optional planar rotation platform and 360 ° axial rotation axis

Ray tube parameters: FXT-160.50 micro focus FXT-160.51 multi focus

Target type penetrating

Voltage range 20 – 160 kV

Current range 0.001 – 1.0 mA

Maximum tube power 64 W maximum

Maximum target power 15 W

Target bombardment material tungsten

Minimum defect detection capability 0.75 μ m 0.35 μ m

X-ray intensity control TXI

Image chain

Geometric magnification~2000 x

System magnification~256000 x

Spatial resolution 1.5 μ m 0.7 μ m

Detector parameter Y.Panel 1308 Y.Panel 1313 ORYX 1616

Detector type Amorphous silicon flat plate digital detector

Maximum pixel resolution 1004 x 620 1004 x 1004 1276 x 1276

Pixel size 127 μ m 2

X-ray receiving area 128 mm x 79 mm 128 mm x 128 mm 162 mm x 162 mm

Digital analog converter 16 bit